The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Journal Home: Journal Homepage
Editor-in-Chief: Shi-Wei Ricky Lee
scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
Print ISSN: 10437398,
Electronic ISSN: 15289044
Abstracting and Indexing: Scopus Science Citation Index Expanded
Imapct Factor 2021: 1.931
Subject Area and Category: Computer Science Computer Science Applications Engineering Electrical and Electronic Engineering Mechanics of Materials Materials Science Electronic, Optical and Magnetic Materials
Publication Frequency:
H Index: 55
Q1:
Q2: Mechanics of Materials
Q3:
Q4:
Cite Score: 3.7
SNIP: 0.861
Journal Rank(SJR): 0.493
Guidelines for Authors: Journal of Electronic Packaging, Transactions of the ASME Author Guidelines
Publisher: The American Society of Mechanical Engineers(ASME)
Country: United States
