Journal of Microelectronics and Electronic Packaging is a publication of the International Microelectronics Assembly and Packaging Society (IMAPS) and is dedicated to publishing peer-reviewed papers in research, development, and the application relating to all aspects of microelectronics packaging, interconnect and assembly technologies.
Journal Home: Journal Homepage
Editor-in-Chief: Jianbiao John Pan
scope: This journal covers materials, processes, reliability, design, systems, and applications in microelectronics assembly and packaging technologies of the present and future including 3D integration, Ceramic Interconnect, Soldering, Flip Chip, Wire Bonding, Encapsulation, RF and microwaves, MEMS, Photonics, Power/High Temperature Electronics, Printed Electronics, LED packaging, and Medical Electronics.
Print ISSN: 15514897,
Electronic ISSN: 15558037
Abstracting and Indexing: Scopus
Imapct Factor :
Subject Area and Category: Computer Science Computer Networks and Communications Engineering Electrical and Electronic Engineering Materials Science Electronic, Optical and Magnetic Materials
Publication Frequency:
H Index: 17
Q1:
Q2:
Q3: Electronic, Optical and Magnetic Materials
Q4:
Cite Score: 1.2
SNIP: 0.328
Journal Rank(SJR): 0.281
Guidelines for Authors: Journal of Microelectronics and Electronic Packaging Author Guidelines
Paper Submissions: Paper Submissions in Journal of Microelectronics and Electronic Packaging
Publisher: IMAPS-International Microelectronics and Packaging Society
Country: United States
