Journal Home:  Journal Homepage
Editor-in-Chief:  Shi-Wei Ricky Lee
Print ISSN:  10437398
Electronic ISSN:  15289044
Abstracting and Indexing:  Scopus, Science Citation Index Expanded
Imapct Factor 2024:  2.3
Subject Area and Category:   Computer Science, Computer Science Applications, Engineering, Electrical and Electronic Engineering, Mechanics of Materials Materials Science Electronic, Optical and Magnetic Materials
Publication Frequency:  
H Index:  65
Q1:  
Q2:  Computer Science Applications
Q3:  
Q4:  
Cite Score:  5.7
SNIP:  1.069
Journal Rank(SJR):  0.524
Latest Articles:   Latest Articles in Journal of Electronic Packaging, Transactions of the ASME
Guidelines for Authors: Journal of Electronic Packaging, Transactions of the ASME Author Guidelines
Publisher:  The American Society of Mechanical Engineers(ASME)
Country:  United States