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Journal of Microelectronics and Electronic Packaging - IMAPS-International Microelectronics and Packaging Society | 2024 Cite Score:1.7 | Q4

Journal of Microelectronics and Electronic Packaging With Cite Score

Cite Score and Journal Rank of Journal of Microelectronics and Electronic Packaging

  • About: The Journal of Microelectronics and Electronic Packaging is dedicated to advancing the field of microelectronics and electronic packaging. It focuses on the latest developments in microelectronic devices, circuits, and packaging technologies, offering insights into the design, fabrication, and application of microelectronic systems. The journal serves as a platform for researchers, engineers, and industry professionals to share their work on innovative solutions and emerging trends in these areas.
  • Objective
    The primary objective of the journal is to publish high-quality research that addresses the challenges and advancements in microelectronics and electronic packaging. It aims to provide a forum for discussing new methodologies, materials, and technologies that enhance the performance, reliability, and manufacturability of microelectronic systems and packaging solutions.
  • Topics Covered
    The journal covers a broad range of topics, including: Microelectronic Device Design and Fabrication Integrated Circuit Technology Semiconductor Devices Packaging Materials and Techniques Thermal Management in Electronics Electromagnetic Compatibility Reliability and Testing of Electronic Systems Miniaturization and Microassembly Advanced Interconnect Technologies 3D Integration and Packaging MEMS (Micro-Electro-Mechanical Systems) Nanotechnology in Electronics
  • Interdisciplinary Approach
    The Journal of Microelectronics and Electronic Packaging takes an interdisciplinary approach by integrating knowledge from materials science, electrical engineering, mechanical engineering, and applied physics. This approach fosters the development of novel solutions that address the complex challenges faced in microelectronics and electronic packaging.
  • Impact and Significance
    The journal has a significant impact on the field by disseminating cutting-edge research that drives innovation in microelectronics and electronic packaging. It contributes to the development of new technologies and methodologies that improve the performance, efficiency, and reliability of electronic systems. The work published in the journal influences both academic research and industry practices, promoting advancements in microelectronic design and packaging.
  • Submission and Review Process
    The journal employs a thorough peer-review process to ensure the quality and relevance of submitted research. Manuscripts are evaluated based on their originality, scientific merit, and practical implications. Accepted papers are published to advance knowledge and support innovation in the field of microelectronics and electronic packaging.

  • Editor-in-Chief:  Jianbiao John Pan

  • Scope: Journal of Microelectronics and Electronic Packaging focuses on the research and development of microelectronics and the packaging technologies that support the functionality, reliability, and performance of electronic devices.
  • Microelectronics:
    Semiconductor Devices: Research on the design, fabrication, and performance of semiconductor devices such as transistors, diodes, and integrated circuits.
  • Microelectromechanical Systems (MEMS): Studies on MEMS devices and their applications in sensing, actuation, and microfluidics.
  • Nanoscale Electronics: Exploration of nanoscale electronic components and systems, including quantum dot devices and nanoelectronics.
  • Integrated Circuits: Research on the design, manufacturing, and testing of integrated circuits (ICs), including analog, digital, and mixed-signal ICs.
  • Electronic Packaging:
    Package Design and Fabrication: Research on the design and fabrication of electronic packages, including printed circuit boards (PCBs), chip-on-board (COB), and system-in-package (SiP) technologies.
  • Thermal Management: Studies on thermal management techniques for electronic packages to ensure efficient heat dissipation and reliability.
  • Electrical Interconnects: Exploration of electrical interconnect technologies, including wire bonding, flip-chip bonding, and soldering techniques.
  • Reliability and Testing: Research on reliability issues and testing methods for electronic packaging, including stress testing and failure analysis.
  • Advanced Materials:
    Packaging Materials: Studies on advanced materials used in electronic packaging, including substrates, encapsulants, and thermal interface materials.
  • Semiconductor Materials: Research on materials used in semiconductor device fabrication, including silicon, gallium nitride (GaN), and silicon carbide (SiC).
  • Manufacturing Processes:
    Process Integration: Research on the integration of various manufacturing processes for microelectronics and packaging.
  • Automation and Quality Control: Studies on automation techniques and quality control measures in the manufacturing of electronic components and packages.
  • Environmental and Sustainability Issues: Exploration of environmental impact and sustainability practices in microelectronics and packaging.
  • Emerging Technologies:
    3D Packaging: Research on 3D packaging technologies, including through-silicon vias (TSVs) and stacked die configurations.
  • Flexible Electronics: Studies on flexible and stretchable electronics, including organic electronics and wearable devices.
  • Advanced Interconnects: Exploration of advanced interconnect technologies, including high-speed and high-density interconnections.
  • Applications:
    Consumer Electronics: Research on the application of microelectronics and packaging technologies in consumer electronics, including smartphones, tablets, and wearables.
  • Automotive Electronics: Studies on the use of microelectronics and packaging technologies in automotive systems, including control units, sensors, and infotainment systems.
  • Medical Devices: Exploration of microelectronics and packaging technologies in medical devices, including implants, diagnostic equipment, and therapeutic devices.
  • Aerospace and Defense: Research on the application of microelectronics and packaging technologies in aerospace and defense systems, including avionics and communication systems.
  • Latest Research Topics for PhD in Computer Science
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  • Print ISSN:  15514897

    Electronic ISSN:   15558037

  • Abstracting and Indexing:  Scopus

  • Imapct Factor :  

  • Subject Area and Category:   Computer Science, Computer Networks and Communications, Engineering, Electrical and Electronic Engineering, Materials Science, Electronic, Optical and Magnetic Materials

  • Publication Frequency:  

  • H Index:  21

  • Best Quartile:

    Q1:  

    Q2:  

    Q3:  

    Q4:  Computer Networks and Communications

  • Cite Score:  1.7

  • SNIP:  0.486

  • Journal Rank(SJR):  0.157