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Stochastic Load Balancing for Virtual Resource Management in Datacenters - 2016

Research Area:  Cloud Computing

Abstract:

Cloud computing offers a cost-effective and elastic computing paradigm that facilitates large scale data storage and analytics. By deploying virtualization technologies in the datacenter, cloud enables efficient resource management and isolation for various big data applications. Since the hotspots (i.e., overloaded machines) can degrade the performance of these applications, virtual machine migration has been utilized to perform load balancing in the datacenters to eliminate hotspots and guarantee Service Level Agreements (SLAs). However, the previous load balancing schemes make migration decisions based on deterministic resource demand estimation and workload characterization, without considering their stochastic properties. By studying real world traces, we show that the resource demand and workload of virtual machines are highly dynamic and bursty, which can cause these schemes to make inefficient migrations for load balancing. To address this problem, in this paper we propose a stochastic load balancing scheme which aims to provide probabilistic guarantee against the resource overloading with virtual machine migration, while minimizing the total migration overhead. Our scheme effectively addresses the prediction of the distribution of resource demand and the multidimensional resource requirements with stochastic characterization. Moreover, as opposed to the previous works that measure the migration cost without considering the network topology, our scheme explicitly takes into account the distance between the source physical machine and the destination physical machine for a virtual machine migration. The trace-driven experiments show that our scheme outperforms the previous schemes in terms of SLA violation and the migration cost.

Author(s) Name:  Lei Yu; Liuhua Chen; Zhipeng Cai; Haiying Shen; Yi Liang and Yi Pan

Journal name:  Published in: IEEE Transactions on Cloud Computing

Conferrence name:  

Publisher name:  IEEE

DOI:  10.1109/TCC.2016.2525984

Volume Information:  Volume: 8, Issue: 2, April-June 1 2020, Page(s): 459 - 472