Amazing technological breakthrough possible @S-Logix

Office Address

  • #5, First Floor, 4th Street Dr. Subbarayan Nagar Kodambakkam, Chennai-600 024 Landmark : Samiyar Madam
  • +91- 81240 01111

Social List

Improving Network Formation in 6TiSCH Networks - 2019

Research Area:  Internet of Things


The industrial Internet of Things (IIoT) is expected to revolutionize the current industry. The capillary introduction of sensors and actuators for real-time monitoring and remote control and their seamless integration into existing information systems will represent a technological breakthrough that will help to reshape the industrial processes. To this aim, the definition of wireless communication standards will play a crucial role in reducing deployment costs and minimizing the time for installation. In this context, the new IPv6 over the TSCH mode of IEEE 802.15.4e communication stack, 6TiSCH, represents the current leading standardization effort that aims at achieving both reliable and timed wireless communication and integration within IPv6 communication networks for industrial systems. In this paper, the network formation dynamics of 6TiSCH networks are assessed, considering the current guidelines for the so-called minimal configuration, a static initial configuration pre-configured to guarantee control communication during network bootstrap. It is shown that the minimal configuration might lead to long network formation and suboptimal performance of the routing algorithm which may result into a disconnected network. In order to overcome this issue, a dynamic resource management algorithm to be executed during network bootstrap is proposed. Simulation and experimental results show that the proposed solution allows to minimize the network formation time and also helps in optimizing routing operations leading to the discovery of better routes.

Author(s) Name:  Carlo Vallati; Simone Brienza; Giuseppe Anastasi; Sajal K. Das

Journal name:  IEEE Transactions on Mobile Computing

Conferrence name:  

Publisher name:  IEEE

DOI:  10.1109/TMC.2018.2828835

Volume Information:  Volume: 18, Issue: 1, Page(s): 98 - 110