Amazing technological breakthrough possible @S-Logix pro@slogix.in

Office Address

  • #5, First Floor, 4th Street Dr. Subbarayan Nagar Kodambakkam, Chennai-600 024 Landmark : Samiyar Madam
  • pro@slogix.in
  • +91- 81240 01111

Social List

Providing a CoAP-based technique to get wireless sensor data via IoT gateway - 2021

Research Area:  Internet of Things

Abstract:

The advancement of wireless sensor networks and the possibility of using Internet protocols in devices with limited resources (such as sensors) have changed the future of the Internet. How to interact and exchange information is one of the challenges in the Internet of Things (IoT). The 6LoWPAN (IP6 Low Power Wireless Personal Area Network) and CoAP (Constrained Application Protocol) standards have been developed for using web protocols in sensor-based LLN (Low-power and Lossy Network). The 6LoWPAN/CoAP protocol stack enables access to the sensor network via web protocols. This facilitates the development of applications on the sensor network and their access to the Internet. Each of the layers of the 6LoWPAN/CoAP protocol stack imposes an overhead on the transmitted messages, and the resulting data overhead intensifies the energy consumption in multi-hop networks. In this paper, a technique is provided to reduce the burden imposed on small and medium-size packets on 6LoWPAN/CoAP multi-hop networks by scheduling and aggregating CoAP packets on sensor nodes. It classifies the CoAP requests/responses over the network (by specifying the maximum allowed delay) and manages the timing and aggregation of received messages on the sensor nodes (based on the maximum allowed delay on each one). The results of the evaluation of the provided technique indicated reducing the power consumption and network traffic for applications such as monitoring in multi-hop networks based on the 6LoWPAN/CoAP protocol stack.

Author(s) Name:  Mohammad Reza Nikseresht, Mahdi Mollamotalebi

Journal name:  Computer Communications

Conferrence name:  

Publisher name:  ELSEVIER

DOI:  https://doi.org/10.1016/j.comcom.2021.03.026

Volume Information:  Volume 172, 15 April 2021, Pages 155-168