Amazing technological breakthrough possible @S-Logix

Office Address

  • #5, First Floor, 4th Street Dr. Subbarayan Nagar Kodambakkam, Chennai-600 024 Landmark : Samiyar Madam
  • +91- 81240 01111

Social List

Deep Multi-View Feature Learning for EEG-Based Epileptic Seizure Detection - 2019

Research Area:  Machine Learning


Epilepsy is a neurological illness caused by abnormal discharge of brain neurons, where epileptic seizure can lead to life-threatening emergencies. By analyzing the encephalogram (EEG) signals of patients with epilepsy, their conditions can be monitored and seizure can be detected and intervened in time. As the identification of effective features in EEG signals is important for accurate seizure detection, this paper proposes a multi-view deep feature extraction method in attempt to achieve this goal. The method first uses fast Fourier transform (FFT) and wavelet packet decomposition (WPD) to construct the initial multi-view features. Convolutional neural network (CNN) is then used to automatically learn deep features from the initial multi-view features, which reduces the dimensionality and obtain the features with better seizure identification ability. Furthermore, the multi-view Takagi-Sugeno-Kang fuzzy system (MV-TSK-FS), an interpretable rule-based classifier, is used to construct a classification model with strong generalizability based on the deep multi-view features obtained. Experimental studies show that the classification accuracy of the proposed multi-view deep feature extraction method is at least 1% higher than that of common feature extraction methods such as principal component analysis (PCA), FFT and WPD. The classification accuracy is also at least 4% higher than the average accuracy achieved with single-view deep features.

Author(s) Name:  Xiaobin Tian; Zhaohong Deng; Wenhao Ying; Kup-Sze Choi; Dongrui Wu; Bin Qin; Jun Wang; Hongbin Shen; Shitong Wang

Journal name:  IEEE Transactions on Neural Systems and Rehabilitation Engineering

Conferrence name:  

Publisher name:  IEEE

DOI:  10.1109/TNSRE.2019.2940485

Volume Information:  Volume: 27, Issue: 10, Oct. 2019